Electronic packaging is a challenging and fascinating field. It is indispensable to IC chip production after the completion of the procedures, is the bridge device to the system. Encapsulate the production process of microelectronic products quality has great influence and competitiveness. According to the current international popular notion that the overall cost of microelectronic device, the design of a third, chip production accounts for a third, and encapsulation and test also accounted for a third, three points is all have one. Encapsulation research in the development of the world is so fast, and it faces the challenges and opportunities and since electronic products have never encountered; Broad encapsulation of the issues involved, and many other areas of rare, it requires from material to process, from inorganic to polymer, from large production equipment to computational mechanics, and so on many, many did not seem related experts of collaborative efforts, is a new high-tech comprehensive very strong discipline.

Encapsulation and reflow soldering device testing, simulation of welding and real welding test and analysis. Feng M series device test reflow soldering

What is electronic packaging, electronic packaging)? Encapsulation is defined as: first protect circuit chip from the influence of the surrounding environment (including physics, chemistry). So, at the beginning of the microelectronics packaging, is made of metal cans (metal can) as a case, the use of completely isolated from the outside world, airtight method, to protect the vulnerable electronic components. However, with the development of integrated circuit technology, especially the chip passivation technology continuously improve, encapsulated function is gradually alienated. Think normally, packaging mainly has four functions, namely, power distribution, signal distribution, heat dissipation and packaging protection, its role from the connection between the integrated circuit device to the system, including electrical connections and physical connection. At present, the integrated circuit chip I/O lines more and more, the power supply and signal transmission are implemented by encapsulating connected to the system; Chip faster and faster, with power is becoming more and more big, make the chip heat dissipation problem is increasingly serious; Due to improve the quality of chip passivation, the importance of the role that packaging to protect the circuit function is declining. The type of electronic packaging is also very complex.

From the use of packaging materials, packaging we can be divided into metal, ceramic and plastic packaging; From molding process, we also can be divided into preforming packaging (pre - mold) and after forming encapsulation (post - mold); As for the packaging appearance, has the SIP (single - line in package), DIP (dual the in - line package), PLCC (plastic leaded chip carrier), PQFP (plastic quad flat pack), the SOP (small outline package), TSOP (thin small - the outline package), PPGA (plastic pin grid array), PBGA (plastic ball grid array) and CSP (chip scale package), etc. If according to the first level is connected to the secondary connection points, in a way that it can be divided into PTH (pin - through - hole) and SMT (surface mount technology) two kinds big, namely usually calls jack type (or hole type) and SMT type. Metal packaging is the most primitive form of semiconductor device package, it will separate components or integrated circuit in a metal container, seal and gold plating nickel. Metal circular shell adopts the kovar alloy materials made from metal base, with the aid of sealing glass, kovar alloy under nitrogen atmosphere will lead the wiring way of melting in a metal base in accordance with the relevant provisions, after lead end of cutting and polishing, nickel plating and gold again inert metal properly protected. Chip installed in the center of the base and in the end of the wire bonding with aluminum silicon silk. After completion of assembly, made of steel belt no. 10 is blunt nickel plating cap seal encapsulate, airtight, solid encapsulation structure. Metal packaging has the advantage of good air tightness, not influenced by the external environment factors. Its disadvantage is that the price is expensive, exterior flexibility is small, cannot satisfy the needs of the development of semiconductor devices are increasingly fast.

Now, the market share accounted for the metal encapsulation has been more and more small, almost has no commercial products. A small amount of products for special performance requirements of military or aerospace technology. After the metal in the ceramic packing is developed a form of encapsulation, it like metal encapsulation, and air tightness, but the price is lower than metal encapsulation, and, after decades of continuous improvement, the performance of the ceramic packaging is getting better and better, especially ceramic flow delay the development of technology, makes the ceramic packaging flexibility in appearance and function have a bigger development. At present, the technology of the ceramic substrate of IBM has reached 100 multilayer wiring, can be passive components such as resistor, capacitor, inductor, etc are integrated in the ceramic substrate, realize high density packaging. Ceramic packing because of its excellent performance, in the aerospace, military, and many large computer has a wide range of applications, occupy about 10% of the packaging market (meter) from the device number. Ceramic packing in addition to have air tightness good advantages, also can realize multiple signals, and the power structure, the layer and has the ability of components of complex integration encapsulation. Its heat dissipation is very good also. Defect is the difference in sintering when assembling dimensional accuracy, high dielectric coefficient () is not applicable to the high frequency circuit, expensive, general is mainly used in some high-end products. Contrast, plastic package that grows more rapidly since the seventy s, has accounted for more than 90% (the amount of packaging) of packaging market, moreover, because the plastic package in the further improvement of materials and technology, the share is on the rise.